CMPSH-3 BK PBFREE

CMPSH-3 CMPSH-3A CMPSH-3C CMPSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES w w w. c e n t r a l s e m i . c o m DESCRIPTION: The CENTRAL SEMICONDUCTOR CMPSH-3 series devices are silicon Schottky diodes designed for surface mount fast switching applications requiring a low forward voltage drop. SOT-23 CASE The following configurations are available: CMPSH-3 CMPSH-3A CMPSH-3C CMPSH-3S SINGLE DUAL, COMMON ANODE DUAL, COMMON CATHODE DUAL, IN SERIES MAXIMUM RATINGS: (TA=25°C) Peak Repetitive Reverse Voltage Continuous Forward Current Peak Repetitive Forward Current Peak Forward Surge Current, tp=10ms Power Dissipation Operating and Storage Junction Temperature Thermal Resistance MARKING MARKING MARKING MARKING CODE: CODE: CODE: CODE: D95 DB1 DB2 DA5 SYMBOL VRRM 30 UNITS V IF 100 mA IFRM IFSM 350 mA 750 mA PD TJ, Tstg 350 mW -65 to +150 °C ΘJA 357 °C/W ELECTRICAL SYMBOL IR IR CHARACTERISTICS PER DIODE: (TA=25°C unless otherwise noted) TEST CONDITIONS MIN TYP MAX VR=25V 90 500 VR=25V, TA=100°C 25 100 BVR IR=100μA VF IF=2.0mA 0.29 0.33 V VF IF=15mA 0.37 0.45 V VF CJ trr IF=100mA 0.51 30 UNITS nA μA V 1.00 V VR=0, f=1.0MHz 20 pF IF=IR=10mA, Irr=1.0mA, RL=100Ω 5.0 ns R8 (8-September 2016) CMPSH-3 CMPSH-3A CMPSH-3C CMPSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES SOT-23 CASE - MECHANICAL OUTLINE 2 1 3 PIN CONFIGURATIONS CMPSH-3 CMPSH-3A CMPSH-3C CMPSH-3S LEAD CODE: 1) Anode 2) No Connection 3) Cathode LEAD CODE: 1) Cathode D2 2) Cathode D1 3) Anode D1, D2 LEAD CODE: 1) Anode D2 2) Anode D1 3) Cathode D1, D2 LEAD CODE: 1) Anode D2 2) Cathode D1 3) Anode D1, Cathode D2 MARKING CODE: D95 MARKING CODE: DB1 MARKING CODE: DB2 MARKING CODE: DA5 R8 (8-September 2016) w w w. c e n t r a l s e m i . c o m CMPSH-3 CMPSH-3A CMPSH-3C CMPSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES TYPICAL ELECTRICAL CHARACTERISTICS R8 (8-September 2016) w w w. c e n t r a l s e m i . c o m CMPSH-3 CMPSH-3A CMPSH-3C CMPSH-3S SURFACE MOUNT SILICON SCHOTTKY DIODES TYPICAL ELECTRICAL CHARACTERISTICS R8 (8-September 2016) w w w. c e n t r a l s e m i . c o m OUTSTANDING SUPPORT AND SUPERIOR SERVICES PRODUCT SUPPORT Central’s operations team provides the highest level of support to insure product is delivered on-time. • Supply management (Customer portals) • Custom bar coding for shipments • Inventory bonding • Custom product packing • Consolidated shipping options DESIGNER SUPPORT/SERVICES Central’s applications engineering team is ready to discuss your design challenges. Just ask. • Free quick ship samples (2nd day air) • Special wafer diffusions • Online technical data and parametric search • PbSn plating options • SPICE models • Package details • Custom electrical curves • Application notes • Environmental regulation compliance • Application and design sample kits • Customer specific screening • Custom product and package development • Up-screening capabilities REQUESTING PRODUCT PLATING 1. If requesting Tin/Lead plated devices, add the suffix “ TIN/LEAD” to the part number when ordering (example: 2N2222A TIN/LEAD). 2. If requesting Lead (Pb) Free plated devices, add the suffix “ PBFREE” to the part number when ordering (example: 2N2222A PBFREE). CONTACT US Corporate Headquarters & Customer Support Team Central Semiconductor Corp. 145 Adams Avenue Hauppauge, NY 11788 USA Main Tel: (631) 435-1110 Main Fax: (631) 435-1824 Support Team Fax: (631) 435-3388 www.centralsemi.com Worldwide Field Representatives: www.centralsemi.com/wwreps Worldwide Distributors: www.centralsemi.com/wwdistributors For the latest version of Central Semiconductor’s LIMITATIONS AND DAMAGES DISCLAIMER, which is part of Central’s Standard Terms and Conditions of sale, visit: www.centralsemi.com/terms w w w. c e n t r a l s e m i . c o m (001)